SEMATECH News
Core Wafer Systems and SEMATECH Partner to Develop Advanced Deep Submicron Reliability Test Solutions for Next-generation Semiconductor Technologies
Austin, TX and Santa Clara, CA (7 December 2009) – SEMATECH and Core Wafer Systems, Inc. (CWS) announced that CWS has joined SEMATECH’s Front End Processes (FEP) program, and will work with SEMATECH to characterize novel transistor processes, emerging technology devices and designs. The partnership will focus on the development and verification of advanced test reliability libraries.
As a member of SEMATECH’s FEP program, CWS will collaborate with FEP experts in the characterization arena to develop an analysis tool for reliability testing of deep submicron devices. The tool set, an advanced deep submicron reliability testing solution codenamed WARp, is, according to CWS CEO Roger Goetz, “a quantum leap from current reliability products in terms of both measurement capability and suitability to manufacturers addressing deep submicron reliability.” WARp, which is scheduled for release in May 2010, is based on CWS’ proprietary parallel measurement scheme for physical phenomena in semiconductor structures
"SEMATECH is pleased to welcome CWS as a partner,” said Raj Jammy, SEMATECH vice president of emerging technologies. “CWS’ proven expertise in reliability data collection and analysis will complement our own technical expertise, as we work together to develop technologies and processes that will extend CMOS and pave the path for beyond CMOS technologies."
Dr. Gennadi Bersuker, SEMATECH fellow, added, "With each new technology node, it is increasingly important to develop an adequate reliability analysis methodology. CWS’ reliability software capabilities will enable us to create a comprehensive characterization software which addresses our industry’s manufacturing needs."
About Core Wafer Systems
Core Wafer Systems Inc. is a technology leader with their propriety parallel measurement schema for physical phenomena of semiconductor structures. Their test systems are employed for magnetics, parametrics and package & wafer-level reliability testing. More information about CWS and its products is available at http://www.corewafer.com.