Quality and Reliability Engineering |
| Document # | Document Name | Publication Date |
| 10065105B-ENG |
450 mm Demonstration Test Method (DTM) |
01/18/2012 |
| 10065100A-ENG |
450 mm Factory Integration Maturity Assessment (FIMA) |
06/17/2010 |
| 04054532A-TR |
Assembly Analytical Forum Analytical Tool Roadmap White Paper |
06/25/2004 |
| 04034510A-TR |
Comparing the Effectiveness of Stress-based Reliability Qualification Stress Conditions |
04/12/2004 |
| 04024492A-TR |
Understanding and Developing Knowledge-based Qualifications of Silicon Devices |
03/30/2004 |
| 03024377A-TR |
Critical Reliability Challenges for The International Technology Roadmap for Semiconductors (ITRS) |
03/31/2003 |
| 01084148A-XFR |
Call for Improved Electromigration Simulation Tool |
08/09/2001 |
| 01054118A-XFR |
Call for Improved Ultra-Low Background Alpha-Particle Emission Metrology for the Semiconductor Industry |
05/14/2001 |
| 00124038A-XFR |
Signature Failure Analysis-Based Methodology for Customer Failure Analysis |
12/08/2000 |
| 00053955A-XFR |
Semiconductor Device Reliability Failure Models |
05/31/2000 |
| 00053958A-XFR |
Knowledge-Based Reliability Qualification Testing of Silicon Devices |
05/31/2000 |
| 99083810A-XFR |
Use Condition Based Reliability Evaluation of New Semiconductor Technologies |
08/20/1999 |
| 99083813A-XFR |
Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages |
08/20/1999 |
| 97123436B-XFR |
Administrative Quality Best Practices |
07/27/1998 |
| 98043497A-XFR |
Optimization of Moisture and Thermal Mechanical End of Line Monitors (EOLMs) |
04/30/1998 |
| 98013452A-TR |
Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies |
02/25/1998 |
| 98013448A-TR |
Overview of Quality and Reliability Issues in the National Technology Roadmap for Semiconductors |
01/20/1998 |