3D Interconnects—Through Silicon Vias (TSVs)
AXI-935 All Surface Inspection Tool
The AXI-935 All Surface Inspection Tool detects particles, chips and scratches as small as two microns on the top, bottom and edge bevel of wafers (all surfaces), both single wafers and bonded wafer pairs. It uses an optical comparison of the wafer surfaces being measured versus a previously trained image of a presumed good wafer. Differences in the measured wafer image are identified as defects, and a map of those defects is created for subsequent review.
